Chris's Recent Papers on Lithography

A few recent presentations:

  1. C. A. Mack, “The future of lithography and its impact on design, presented at the SPIE Advanced Lithography Conference, February 27, 2013.
  2. C. A. Mack, "Line-Edge Roughness and the Ultimate Limits of Lithography", presented at the SPIE Advanced Lithography Conference, February, 2012.

 

The papers listed below are available (on-line or in PDF format) by clicking on the titles.

  1. Siddharth Chauhan, et al., “Mesoscale modeling: a study of particle generation and line-edge roughness”, Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol. 13, No. 1 (Jan–Mar, 2014) p. 013012.
  2. Chris A. Mack, John J. Biafore, and Mark D. Smith, “Stochastic Exposure Kinetics of Extreme Utraviolet Photoresists: Trapping Model ”, Journal of Vacuum Science & Technology B, Vol. 31, No. 6 (Nov/Dec, 2013) p. 06F603-1.
  3. C. A. Mack, “Defining and measuring development rates for a stochastic resist: a simulation study”, Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol. 12, No. 3 (Jul-Sep, 2013) p. 033006.
  4. C. A. Mack, "Systematic Errors in the Measurement of Power Spectral Density", Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol. 12, No. 3 (Jul-Sep, 2013) p. 033016.
  5. C. A. Mack, "Generating random rough edges, surfaces, and volumes", Applied Optics, Vol. 52, No. 7 (1 March 2013) pp. 1472-1480.
  6. C. A. Mack, “Reaction-diffusion power spectral density Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol. 11, No. 4 (Oct-Dec, 2012) p. 043007.
  7. Prateek Mehrotra, Chris A. Mack, Richard J. Blaikie, “A solid immersion interference lithography system for imaging ultra-high numerical apertures with high-aspect ratios in photoresist using resonant enhancement from effective gain media”, Optical Microlithography XX, Proc., SPIE Vol. 8326 (2012) p. 83260Z.
  8. C. A. Mack, “Correlated surface roughening during photoresist development”, Advances in Resist Technology and Processing XXIX, Proc., SPIE Vol. 8325 (2012) p. 83250I.
  9. C. A. Mack, “Defining and measuring development rates for a stochastic resist”, Advances in Resist Technology and Processing XXIX, Proc., SPIE Vol. 8325 (2012) p. 83251K.
  10. C. A. Mack, "Analytic form for the power spectral density in one, two, and three dimensions", Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol. 10, No. 4 (Oct-Dec, 2011) p. 040501.
  11. Chris A. Mack, James W. Thackeray, John J. Biafore, and Mark D. Smith, “Stochastic Exposure Kinetics of EUV Photoresists: A Simulation Study”, Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol. 10, No. 3 (Jul-Sep, 2011) p. 033019.
  12. Chris A. Mack, “Fifty Years of Moore’s Law”, IEEE Transactions On Semiconductor Manufacturing, Vol. 24, No. 2 (May, 2011) pp. 202-207.
  13. C. A. Mack, “A New Fast Resist Model: the Gaussian LPM”, Design for Manufacturability through Design-Process Integration V, Proc., SPIE Vol. 7974 (2011) p. 79740B.
  14. C. A. Mack, John J. Biafore, and Mark D. Smith, “Stochastic Acid-Base Quenching in Chemically Amplified Photoresists: A Simulation Study”, Advances in Resist Technology and Processing XXVIII, Proc., SPIE Vol. 7972 (2011) p. 79720V.
  15. C. A. Mack, “Stochastic modeling of photoresist development in two and three dimensions”, Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol. 9, No. 4 (Oct-Dec, 2010) p. 041202.
  16. Chris A. Mack, “A Simple Model of Line-Edge Roughness”, Future Fab International, Vol 34 (July 14, 2010).
  17. C. A. Mack, “Line-Edge Roughness and the Ultimate Limits of Lithography”, Advances in Resist Technology and Processing XXVII, Proc., SPIE Vol. 7639 (2010) p. 763931.
  18. C. A. Mack, “Impact of mask roughness on wafer line-edge roughness”, BACUS Symposium on Photomask Technology, Proc., SPIE Vol. 7488 (2009) p. 748828.
  19. C. A. Mack, “Stochastic Modeling in Lithography: The Use of Dynamical Scaling in Photoresist Development”, Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol. 8, No. 3 (Jul-Sep, 2009) p. 033001.
  20. C. A. Mack, “Stochastic Modeling in Lithography: Autocorrelation Behavior of Catalytic Reaction-Diffusion Systems”, Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol. 8, No. 2 (Apr-Jun, 2009) p. 029701.
  21. C. A. Mack, “Stochastic approach to modeling photoresist development”, Journal of Vacuum Science & Technology, Vol. B27, No. 3 (May/Jun, 2009) pp. 1122-1128.
  22. S. Chauhan, M. Somervell, S. Scheer, C. Mack, R. T. Bonnecaze, and C. G. Willson, “Polymer Dissolution Model: An Energy Adaptation of the Critical Ionization Theory”, Advances in Resist Technology and Processing XXVI, Proc., SPIE Vol. 7273 (2009) p. 727336.
  23. Chris A. Mack, “Seeing Double”, IEEE Spectrum (Nov, 2008) pp. 46-51.
  24. Chris A. Mack, “Fab Future”, SPIE Professional (Oct, 2008) pp. 10-11.
  25. C. A. Mack, "The Future of Semiconductor Lithography: After Optical, What Next?", Future Fab International, Vol. 23 (July 9, 2007).
  26. C. A. Mack, D. Harrison, C. Rivas, and P. Walsh, “Impact of thin film metrology on the lithographic performance of 193nm bottom antireflective coatings”, Optical Microlithography XX, Proc., SPIE Vol. 6518 (2007) p. 65181C.
  27. C. A. Mack, “What's So Hard About Lithography?”, presented at the ICMTS (March, 2006).
  28. C. A. Mack, "Accuracy, speed, new physical phenomena: The future of litho simulation", Solid State Technology, Vol. 49, No. 2 (February, 2006) pp. 28-40.


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